solder resist glue

solder resist glue
Overview parameter

Product Features

1. Applies to the coated area of the circuit board; can be easily peeled off by hand or tweezers without leaving residue.

2. Short-term temperature resistance up to 280℃.

3. Will not oxidize gold, copper, phosphorus, or bronze.

4. Does not corrode components.

5. Prevents contamination during assembly.

6. Completely biodegradable, meeting environmental protection requirements.


Product Applications: 

Widely applicable to various products requiring temporary solder resist, protection, and masking, such as wave soldering and coating processes.

1. Applied to circuit boards requiring solder resist during wave soldering to prevent the circuit board surface from contacting molten solder.

2. Can be used for solder resisting connectors, gold fingers, screw holes, apertures, electronic components, etc.

3. Protects sensitive components in electronic products before conformal coating.


Information

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